ligitek electronics co.,ltd. property of ligitek only la16b/y-s7-pf data sheet led array doc. no : qw0905-la16b/y-s7-pf rev. : a date : 18 - oct. - 2005 pb lead-free parts
page 1/5 package dimensions ly2340-1-pf 3.0 1.5max 0.5 typ - + 2.54typ 25.0min 1.0min 5.0 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. la16b/y-s7-pf ligitek electronics co.,ltd. property of ligitek only - + 18.0min 2.54typ 0.5 typ 1.0min 2.4 0.5 4.6 5.08 3.5 7.4 6.5 4.75typ
page 2/5 unit ma ma ratings y 80 20 part no. la16b/y-s7-pf symbol i fp i f parameter peak forward current duty 1/10@10khz forward current absolute maximum ratings at ta=25 a 10 -40 ~ +100 -40 ~ +85 ir tstg t opr operating temperature storage temperature reverse current @5v power dissipationpd60 mw luminous intensity @10ma(mcd) forward voltage @20ma(v) 80 typ. min. 20 8.0 min. 1.7 35 585 max. 2.6 peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) color part nomaterial lens emitted yellow la16b/y-s7-pf gaasp/gap yellow diffused note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page3/5 part no. la16b/y-s7-pf
0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max part no. la16b/y-s7-pf
page 5/5 description this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. reliability test: part no. la16b/y-s7-pf test item operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hous. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test low temperature storage test thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec reference standard mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only
|
